XPG LANCER BLADE
DDR5 | kit | 32 GB: 2 x 16 GB | DIMM 288-pin low profile | 6000 MT/s / PC5-24000 | CL30 | 1.35 | 1.4 V | unbuffered | on-die ECC | black
Main Specification
| Product Description | XPG LANCER BLADE - DDR5 - kit - 32 GB: 2 x 16 GB - DIMM 288-pin / PC5-24000 - unbuffered |
|---|---|
| Product Type | Memory kit |
| Capacity | 32 GB: 2 x 16 GB |
| Memory Type | DDR5 SDRAM - DIMM 288-pin low profile |
| Upgrade Type | Generic |
| Data Integrity Check | On-die ECC |
| Speed | 6000 MT/s (PC5-24000) |
| Latency Timings | CL30 (30-40-40) |
| Features | Intel Extreme Memory Profiles (XMP 3.0), AMD extended profiles for overclocking (EXPO), built-in Power Management IC (PMIC), low-profile heatsink, unbuffered |
| Voltage | 1.35 - 1.4 V |
General
| Capacity | 32 GB: 2 x 16 GB |
|---|---|
| Upgrade Type | Generic |
| Width | 33.8 mm |
| Depth | 7.8 mm |
| Height | 133.35 mm |
| Weight | 32.92 g |
Memory
| Type | DRAM memory kit |
|---|---|
| Technology | DDR5 SDRAM |
| Form Factor | DIMM 288-pin low profile |
| Speed | 6000 MT/s (PC5-24000) |
| Latency Timings | CL30 (30-40-40) |
| Data Integrity Check | On-die ECC |
| Features | Intel Extreme Memory Profiles (XMP 3.0), AMD extended profiles for overclocking (EXPO), built-in Power Management IC (PMIC), low-profile heatsink, unbuffered |
| Voltage | 1.35 - 1.4 V |
Miscellaneous
| Colour Category | Black |
|---|
Manufacturer Warranty
| Shipping Dimensions (WxDxH) / Weight | 141 mm x 170 mm x 12.2 mm / 113 g |
|---|
Product features
Efficient data transfer
With a data transfer rate of 6000 MT/s, the memory kit ensures rapid and smooth data handling, enhancing system performance for applications.Reliable memory handling
Equipped with on-die ECC technology, this memory provides error correction capabilities that enhance data reliability during tasks.Beneficial power management
The built-in Power Management IC (PMIC) helps to manage energy use effectively, contributing to improved system stability and efficiency.Versatile compatibility
The memory supports both Intel XMP 3.0 and AMD EXPO profiles, allowing for easy overclocking and system tuning based on user needs.Compact design
The low-profile heatsink design ensures adequate cooling and fits seamlessly into smaller system cases without obstructing components.Key selling points
- 32 GB capacity with 2 x 16 GB modules
- High data transfer rate of 6000 MT/s
- Low CAS Latency of CL30 for improved performance
- Compatible with Intel XMP 3.0 and AMD EXPO for overclocking
- Low-profile design for compact installations
References
MPN: AX5U6000C3032G-DTLABBK
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23/06/2026 21:45:46